3D Implementation TSV Processing Technology (MEMS)
Realization of high functionality through high integration devices. 3D packaging (stacked chip) processing technology.
This is an introduction to 3D implementation TSV processing technology (MEMS). MEMS refers to micro-meter-sized mechanical components, sensors, actuators, electronic circuits, and controllers that are integrated into a micro-electromechanical system. It is manufactured using micromachining technology that applies semiconductor processes. Conventional semiconductor manufacturing processes are primarily used for forming two-dimensional shapes, while three-dimensional shapes are created using techniques such as sacrificial layer etching and self-formation. Practical applications have been realized in inkjet printer heads, DMD projectors, pressure sensors, accelerometers, RF components, and applications are beginning in a wide range of fields including automobiles, airplanes, biotechnology, medical, information communication, and robotics. For more details, please contact us or download the catalog.
- Company：グローバルネット株式会社
- Price：Other
